Get ready for a new category in the computer market: the ‘slidable’, which brings flexible OLED to the computer in the same way that display technology spawned the foldable smartphone.
Intel and Samsung teased the new, future-sliding category at Intel’s Innovation conference, showing off a device that looks like a tablet, lacks a physical keyboard and has a screen that rolls up from 13 inches to 17 inches.
Could this be the PC form factor that brings more Intel chips to Android devices, or Windows tablets that challenge Apple’s M1 iPads?
Intel CEO Pat Gelsinger and Samsung’s head of displays JS Choi showed off the 17-inch slider as the first example of its OLED slider technology for Intel-based PCs.
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Choi said it’s “the world’s first 17-inch sliding screen for computers,” which he expects to meet a variety of needs for portability and larger screens.
The demo model expands what is possible for computers with OLED display technology inside a flexible plastic substrate.
“Foldable away, but it’s just the beginning,” Choi said, although it was unclear whether he was referring to computers or foldable smartphones. He added: “With this sliding flexible and software collaborations, we expect to see better and better computer user scenarios in the future.”
On the subject of bridging PCs to smartphones, Intel said its Unison app for connecting Android phones to PCs will start running on select 12th-gen Intel Core processor-based Evo PCs this year.
Intel also showed off its 13th-gen “Raptor Lake” architecture chips, a refinement to its 12th-gen answer to Apple Silicon processors, which introduced CPU cores optimized for performance and efficiency. The 13th-gen chips have twice the number of efficient cores than the previous generation.
Gelsinger opened his keynote by declaring that Moore’s Law, which is slowing down, is not dead. “Is Moore’s Law dead? And the answer is no,” Gelsinger said. “We will continue to be the administrators of Moore’s Law. You got it? Alive and well.”
In February, Intel announced that it would buy Israel-based Tower Semiconductor for $6 billion to strengthen Intel Foundry Services (IFS). Gelsinger hopes that this will become an interconnect of chip manufacturing, with “chiplets” supplied by TSMC, Texas Instruments, Samsung and others through the new UCIe, the Universal Chiplet Interconnect Express standard.
Referring to IFS, Gelsinger said the industry is “moving from a system on a chip (SoC) to a system on a package”.
“There must be greater packaging and even Gordon Moore, when he wrote his original paper on Moore’s Law, he foresaw this day of reckoning where we will have to build larger systems out of smaller functions combining heterogeneous, customized situations. And with … 3D stacking, that gives the ability to increase the number of transistors per device.”